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AIEV Laser Technology is a cutting-edge term that defines a class of laser systems specifically designed to meet the demands of next-generation substrates like Silicon Carbide (SiC), ceramics, glass, Gallium Nitride (GaN), and synthetic diamond. AIEV lasers are engineered to process these advanced materials, which are essential for high-power, high-temperature, and high-frequency applications in industries such as AI semiconductors and electric vehicles (EVs).

Key Features of AIEV Laser Technology

1. High-Power Output: AIEV lasers are designed to generate high-power beams capable of processing extremely hard and brittle materials like SiC and synthetic diamond with minimal mechanical or thermal damage.

2. High-Precision Scribing and Cutting: These lasers offer micron-level precision, essential for the detailed scribing and cutting required in AI semiconductors and EV components, ensuring clean edges and minimized material waste.

3. Wide Compatibility with Advanced Substrates: AIEV laser technology is optimized to work with a wide range of next-generation substrates:
– Silicon Carbide (SiC) for high-voltage EV inverters and power modules.
– Gallium Nitride (GaN) for high-frequency RF devices and AI data processing units.
– Ceramics for thermal management and insulation in high-power devices.
– Glass for optical devices, displays, and long-term data storage.
– Synthetic diamond for thermal management and high-performance computing.

4. Thermal Control and Minimal Heat-Affected Zones (HAZ): Designed with advanced thermal management capabilities, AIEV lasers drastically reduce heat-affected zones, preventing microcracking or warping in temperature-sensitive materials like GaN and glass.

5. High-Frequency Processing: AIEV lasers are built to meet the high-frequency needs of AI semiconductors, enabling rapid switching speeds and signal processing for next-gen AI chips and 5G infrastructure.