Key Requirements for Laser Scribing Technology in High Thermal Semiconductors

As semiconductors for AI applications and electric vehicle (EV) components become more advanced, the need for new laser scribing technologies arises primarily due to the increasingly demanding thermal, precision, and material requirements. These new semiconductor devices operate under extreme conditions, including high temperatures, high power densities, and fast switching speeds, necessitating laser systems that can meet stringent manufacturing and material processing standards.

Why New Lasers are Needed for High-Thermal Requirements in Semiconductors

1. Heat Sensitivity of Advanced Materials:
   • AI Semiconductors: AI chips are densely packed with transistors and operate at very high frequencies, which generates significant heat. These chips are also made from sensitive materials like silicon, Silicon Carbide (SiC), and gallium nitride (GaN), which can be damaged by excessive thermal input during manufacturing processes like scribing. New laser technologies, such as femtosecond lasers, minimize the heat affected zone (HAZ), allowing precise material removal without causing damage to surrounding structures.
   • EV Components: SiC, GaN, and other materials used in EV power electronics, such as inverters, converters, and motor controllers, have high thermal conductivity and require precise thermal management during manufacturing. Traditional laser systems may introduce too much heat, leading to cracks, warping, or other damage in the high-performance components, which can negatively affect their electrical and thermal characteristics.
2. High Power Density and Fast Switching:
   • Power electronics in both AI semiconductors and EV components need to handle high voltages and currents with fast switching. This creates a demand for lasers that can accurately process smaller features with greater precision while preventing defects.
   • New laser systems are required to reduce the thermal load during the scribing process, especially for materials like SiC that can suffer from microcracking under conventional laser techniques.
3. Complex Multi-Layer Structures:
   • AI chips and power electronics in EVs often have multi-layered structures with high component density. Older laser systems may not have the precision or control needed to work with these complex structures without causing layer delamination or thermal stress. New lasers, particularly ultrashort pulse lasers (femtosecond or picosecond), enable precision processing at the micro- or nano-scale while minimizing the risk of overheating adjacent layers.
4. Material Hardness and Thermal Resistance:
   • Materials like SiC and GaN, which are essential for high-performance applications in AI and EVs, are much harder and more thermally resistant than traditional silicon. They require higher energy lasers with improved precision to perform cutting, drilling, and patterning without causing thermal damage or inducing residual stress. These materials require laser scribing technologies that can handle extreme hardness without sacrificing precision.

Key Requirements for Laser Scribing Technology in High-Thermal Semiconductor Applications

1. Minimal Heat-Affected Zone (HAZ):
   • Lasers need to confine thermal energy to a small area to avoid damaging the surrounding material. Ultrafast lasers, such as femtosecond or picosecond lasers, are essential as they emit pulses that are too short for heat to diffuse into the material, minimizing HAZ.
2. High Precision and Control:
   • Semiconductor devices, especially for AI and EVs, require extremely fine feature sizes with precise edge control. Lasers must be able to control the depth and width of the scribing to create clean, precise cuts, minimizing the need for post-processing and reducing the likelihood of defects.
3. Adaptability for Advanced Materials:
   • Laser systems need to accommodate new materials like SiC, GaN, ceramics, and composite materials, all of which have very different thermal and optical properties compared to silicon. Lasers with variable wavelength capabilities or highly tunable parameters (e.g., power, frequency, and pulse duration) are needed to process a broad range of materials.
4. Non-Contact Processing:
   • Since traditional mechanical processes (e.g., sawing or mechanical dicing) can induce stress, laser scribing offers a non-contact solution that reduces the risk of mechanical damage, contamination, or material stress fractures, particularly critical in brittle materials like SiC and GaN.
5. High Speed and Throughput:
   • As production volumes for AI chips and EV power electronics increase, the laser scribing technology must be capable of high-speed processing without sacrificing accuracy or quality. Lasers must be fast enough to keep up with high-throughput manufacturing environments while maintaining precision in each cut or scribe.
6. Compatibility with Multi-Layer Devices:
   • AI semiconductors and EV components often consist of multi-layer structures with interconnects. The laser scribing technology must be capable of processing multiple layers without causing damage or distortion to the underlying materials. This requires advanced control over the laser depth and power.
7. Automation and Integration:
   • For mass production in AI and EV industries, laser scribing systems must be easily integrated into automated manufacturing lines. They need to be highly reliable, capable of operating 24/7 with minimal maintenance, and compatible with other semiconductor processing technologies like lithography, deposition, and etching.

Conclusion

The high thermal and precision requirements of AI semiconductors and EV components drive the need for new laser scribing technologies. Innovations such as ultrafast lasers (femtosecond and picosecond) and advanced control systems are essential for processing modern materials like SiC, GaN, ceramics, and glass without inducing thermal or mechanical damage. These new technologies allow for higher power densities, smaller features, and faster switching speeds, while minimizing defects and ensuring high-quality production. As AI and EV industries continue to expand, the demand for advanced laser scribing systems will only increase, shaping the future of semiconductor manufacturing.