A New Standard for Next-Generation Substrate Processing AIEV Laser Technology (Artificial Intelligence and Electric Vehicle Laser Technology) is a cutting-edge term that defines a class of laser systems specifically designed to meet the demands of next-generation substrates like Silicon Carbide (SiC), ceramics, glass, Gallium Nitride (GaN), and synthetic diamond. AIEV lasers are engineered to process […]
Laser technology plays a critical role in the manufacturing and processing of advanced materials such as Silicon Carbide (SiC), glass, ceramics, Gallium Nitride (GaN), and synthetic diamond. Each of these materials has unique properties that make them essential for high-power and microelectronics applications, but they also present significant challenges when it comes to cutting, structuring,
Critial Role of Laser technology in advanced material processing Read More »
What is a Silicon Carbide (SiC) Wafer? Silicon Carbide (SiC) wafers are semiconductors composed of a combination of silicon (Si) and carbon (C) atoms arranged in a crystalline structure. SiC is a wide-bandgap material, meaning it has an energy bandgap (3.26 eV for 4H-SiC) significantly wider than that of silicon (1.12 eV), the traditional semiconductor
As semiconductors for AI applications and electric vehicle (EV) components become more advanced, the need for new laser scribing technologies arises primarily due to the increasingly demanding thermal, precision, and material requirements. These new semiconductor devices operate under extreme conditions, including high temperatures, high power densities, and fast switching speeds, necessitating laser systems that can
Key Requirements for Laser Scribing Technology in High Thermal Semiconductors Read More »
The Rise of New Substrates for High-Power Electronics and How to Select Laser Scribing Technology The rapidly advancing field of high-power electronics is driving the need for more efficient, robust, and heat-tolerant components. Traditional silicon, once the standard material for power electronics, is being overtaken by newer, more advanced substrates. These alternatives offer superior performance
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Silicon Carbide (SiC) Laser Scribing has become increasingly crucial in the semiconductor industry, particularly with the rising demands of artificial intelligence (AI) semiconductors and electric vehicle (EV) applications. SiC is favored in high-power, high-temperature, and high-frequency applications due to its superior thermal and electrical properties compared to silicon. Laser scribing is a critical step
Electrical steel is a specialized type of steel with exceptional magnetic properties, making it crucial for the efficient operation of many electrical devices. Here’s a breakdown of its efficiency, applications, market size, and green economy significance: Efficiency: Key Applications: Market Size: Importance for Green Economy: Overall, electrical steel’s unique properties and efficiency make it a
Electrical steel has become increasingly critical for energy efficiency as the world transitions to cleaner power. This metallic alloy helps power transformers, motors, generators and other electrical equipment work more efficiently. However, the standards for testing and evaluating electrical steel performance have not kept pace. Importance of Electrical Steel Electrical steel is fundamentally enabling energy
Electrical Steel Efficiency: Increasing importance and outdated standards. Read More »
Laser Magnetic Domain Refinement (LMDR) isn’t just a champion for transformers and motors; it’s also poised to revolutionize the microscopic world of micromachining and electronics. Let’s explore how this laser-powered technology can improve efficiency, precision, and capabilities in these crucial fields: Micromachining: Electronics: Challenges and Future Potential: While LMDR holds immense promise, it faces some
Laser Magnetic Domain Refinement (LMDR) offers a promising approach to minimize hysteresis loss, a major contributor to core loss in electrical steel. Here’s an exploration of how LMDR can achieve this: Mechanism of Action: Hysteresis loss arises from the energy required to overcome friction between magnetic domains as they align and realign with the applied